Yttria Stabilized Zirconia Ceramic Flow-splitting Nozzle Plate for Semiconductor

Yttria Stabilized Zirconia Ceramic Flow-splitting Nozzle Plate for Semiconductor

Product Description

This Yttria Stabilised Zirconia Flow-splitting Nozzle Plate offers plasma corrosion resistance far superior to that of alumina ceramics. Its ultra-high toughness enables it to withstand extreme temperature fluctuations and high-velocity gas flow impacts without chipping or cracking. Featuring a mirror-polished inner nozzle surface and a low-porosity structure, the plate generates minimal particulates, meeting the stringent cleanroom production requirements for high-end chips. Equipped with an array of flow-splitting nozzles and elongated flow channels, it ensures the uniform delivery of highly corrosive fluorine- and chlorine-based process gases, thereby stabilizing wafer processing. Dimensions, nozzle apertures, and hole positions can be precision-customized to the micron level based on technical drawings. The plate offers significantly extended service life in harsh plasma environments and reduces equipment maintenance costs, providing a one-stop precision zirconia ceramic processing solution for global manufacturers of semiconductor and new energy equipment.

Product Core Advantages

1. Phase-transformation toughening mechanism: the "steel" of ceramics

Pure zirconia undergoes phase transitions—monoclinic ↔ tetragonal ↔ cubic—in response to temperature changes; these transitions are accompanied by a volume change of approximately 4–5%, which causes the material to crack. By precisely doping the material with 3 mol% yttrium oxide (Y₂O₃), the high-temperature tetragonal phase is stabilized down to room temperature, resulting in the formation of tetragonal zirconia polycrystals (TZP).Under stress, the metastable tetragonal phase within the material enables stress-induced phase transformation toughening; by absorbing the energy of crack propagation through this phase transformation, the fracture toughness of YSZ ceramics exceeds 7 MPa·m½—far surpassing traditional ceramics like alumina—earning it the reputation of "ceramic steel."

2.Ultra-high mechanical strength, capable of withstanding extreme operating conditions

   Flexural strength: ≥900 MPa (3Y-TZP), ranking among the highest of all oxide ceramics

   Compressive strength: ≥2200 MPa

   Vickers hardness: ≥1300 HV, offering excellent wear resistance

   Elastic modulus: approximately 220 GPa, comparable to steel, facilitating integration with metal structural components

   Maintains structural integrity over extended periods, even under severe mechanical stress and plasma bombardment.

3.Precision microporous flow-distribution structure ensures uniform plasma distribution.

   Utilizes precision laser drilling and CNC micromachining technologies; hole diameters range from 0.1 to 2.0 mm (customizable) with a positional accuracy of ±5 μm.

   Optimized hole array layout ensures uniform gas/plasma distribution within the chamber, preventing localized over-etching or under-etching.

   The flow-distribution plate features a precision-ground and polished surface with a roughness of Ra ≤ 0.1 μm, minimizing particle contamination and gas turbulence.

4.Excellent resistance to plasma corrosion

   Demonstrates exceptional chemical inertness against fluorine-, chlorine-, and oxygen-based plasmas

   In semiconductor etching processes (such as ICP, CCP, and RIE), it offers far superior resistance to halogen gas corrosion (e.g., CF₄, SF₆, Cl₂) compared to traditional materials like quartz and alumina; its low particle generation rate effectively reduces chamber contamination and wafer defects.

5.Excellent thermal shock resistance

   Coefficient of thermal expansion: 10.3 × 10⁻⁶/°C (20–1000°C); good thermal compatibility with metal structural components

   Thermal conductivity: 2.0–2.5 W/m·K; low thermal conductivity effectively reduces heat loss

   Thermal shock resistance (ΔT): 280–350°C; capable of withstanding rapid heating and cooling cycles

   Long-term service temperature: ≤850°C (structural components); capable of withstanding higher temperatures for short periods\

6.Precision Geometric Accuracy

   Flatness: ≤5 μm (depending on dimensions)

   Parallelism: ≤3 μm

   Bore Diameter Tolerance: ±2 μm

   Ensures a perfect fit with the chamber sealing surface, preventing gas leakage and cross-contamination.

Technical Specifications

Product Applications

1.Semiconductor Manufacturing

   ICP/CCP plasma etching equipment: upper/lower electrode showerheads that evenly distribute etching gas and control plasma density distribution

   PECVD/CVD equipment: gas distribution plates ensuring uniform deposition of reactant gases

   Dry etching chambers: resistant to fluorine- and chlorine-based plasma corrosion, extending chamber maintenance intervals

   Wafer cleaning equipment: chemically resistant flow-splitting and spraying components

2.Display Panel Manufacturing

   OLED/LCD etching equipment: large-area gas distribution ensures etching uniformity across the panel.

   Thin-Film deposition equipment: precision gas flow splitting controls film thickness uniformity.

3.Photovoltaics and New Energy

   Solar cell etching: acid/alkali-resistant and highly wear-resistant flow distribution components

   Fuel cells (SOFC): YSZ used as a solid electrolyte material for high-temperature gas distribution and electrode support

4.Precision Machining and Specialized Equipment

   Sandblasting/plasma spraying nozzles: high hardness and wear resistance; service life far exceeds that of traditional metal nozzles.

   High-Temperature Furnace Gas Distribution Systems: withstand ultra-high temperatures exceeding 2500°C (refractory-grade YSZ).

Product Series

Quality Assurance

1. Powder Quality: Utilizes top-tier international 3Y-TZP nanopowders (e.g., Saint-Gobain) to ensure batch-to-batch consistency.
2. Forming Process: Isostatic pressing combined with high-temperature sintering (>1500°C); achieves a relative density of ≥99.5%.
3. Precision Machining: 5-axis CNC machining, laser micro-hole processing, and precision grinding/polishing.

Inspection system:

1. Coordinate Measuring Machine (CMM) for geometric accuracy.
2. Scanning Electron Microscopy (SEM) for microstructure analysis.
3. X-Ray Diffraction (XRD) to verify tetragonal phase content.
4. Helium mass spectrometry leak detection to verify airtightness.
5. Clean Delivery: Cleaned in a Class 100 cleanroom and vacuum-packaged to meet semiconductor industry cleanliness standards.

Customized Services

We provide end-to-end customized solutions:

Comparison with Competitor Materials

YSZ Ceramic Gas-Splitting Nozzle Plate—Leveraging the exceptional toughness of "ceramic steel" to provide long-life, high-reliability, and low-contamination plasma gas-splitting solutions for precision semiconductor manufacturing.

Our workshop

Why choose us?

1.Customized R&D, rather than standard product adaptation

2.Deep control of materials science：Material Selection Based on Needs，Microstructure Optimization，Batch Consistency

3.Precision machining capability：Flatness can reach 0.001mm, parallelism 0.002mm, and roughness Ra 0.1μm.

FAQ

Q1: What products does your company offer?

We specialize in high-performance ceramics such as alumina and silicon nitride, providing insulators, structural components, wear-resistant parts, and customized solutions.

Q2: Can you customize non-standard parts?

Yes. We support processing based on provided drawings and collaborative technical development, offering a full-process service from design to mass production.

Q3: What about accuracy and delivery time?

Standard tolerance ±0.05mm, precision grade ±0.01mm; samples 7-15 days, bulk orders 20-30 days.

Q4: Main application areas?

Power, electronics, machinery, chemical, and aerospace industries.

Q5: Quality assurance measures?

Full-process quality inspection, providing material reports and performance test data, supporting third-party certification and testing.

Q6: Do you provide technical support?

We provide professional support such as material selection consultation, design optimization, and failure analysis.