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Aluminum Nitride Ceramic

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High Thermal Conductivity Aluminum Nitride AlN Ring Disc for Semiconductor

Name: High Thermal Conductivity Aluminum Nitride AlN Ring Disc for Semiconductor
Availability: InStock

High Thermal Conductivity AlN Ring Disc is a core functional component specifically designed for critical scenarios such as high-end electronic heat dissipation, high-temperature semiconductor load handling, and high-frequency insulation, used to improve power density and reliability.

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High Thermal Conductivity Aluminum Nitride Ring

Product Description

AlN Ring Disc are precision ring-shaped components made of high-purity aluminum nitride (AlN) ceramic material, fully utilizing the unique advantages of aluminum nitride in terms of thermal, electrical, and mechanical properties. As a key material for third-generation semiconductors, aluminum nitride rings play an irreplaceable role in modern high-end manufacturing due to their perfect combination of high thermal conductivity and electrical insulation.

Structural Design and Precision Machining

1.Advantages of the Ring Structure

The aluminum nitride ring achieves multiple functions through its central opening design:

(1)Assembly Positioning: Precision drilling facilitates mechanical fixing and assembly.

(2)Fluid Channel: Allows gas or liquid flow, optimizing heat dissipation paths.

(3)Stress Dispersion: The ring structure evenly distributes thermomechanical stress, avoiding stress concentration.

2.Manufacturing Process

(1)Powder Preparation: High-purity, high-sintering-activity aluminum nitride powder is used to ensure the density and performance consistency of the final product.

(2)Forming Process: Compression molding or isostatic pressing is used (slip casting is not used due to the easy hydrolysis of AlN).

(3)Sintering Technology:Hot Press Sintering: Obtains high-density, high-performance products.

(4)Atmospheric Pressure Sintering: Suitable for large-scale production, with relatively controllable costs.

(5)Precision Machining: Diamond tools are used for turning, drilling, and grinding, achieving a surface roughness of Ra 0.3-0.5μm; precision machining can achieve Ra 0.2μm.

Summary of key performance parameters

Volume resistivity	1.4×10¹⁴ Ω·cm	GB/T 1410
Breakdown strength	18.45 kV/mm	GB/T 1408
Dielectric constant	8.56 @1MHz	GB/T 5594
Coefficient of thermal expansion	2.805×10⁻⁶/℃ (20-300℃)	GB/T 16535
Surface roughness	Ra 0.3-0.5 μm	Precision machining can achieve Ra 0.2μm
Outward tilt	≤2‰	Ensure verticality

Typical application areas

1.Semiconductor manufacturing equipment	(1)Wafer Chucks and Carriers: Provide electrostatic adsorption and uniform heat conduction in processes such as etching and thin film deposition. (2)Insulating Rings and Calibration Components: Used in plasma etching chambers to isolate high voltage and withstand corrosive gases. (3)Power Module Substrates: Provide heat dissipation and insulation support for high-power transistors and IGBTs.
2.ptoelectronic and RF Devices	(1)Laser Diode Base: Rapidly dissipates heat generated by the laser, ensuring wavelength stability. (2)Laser diode base: rapidly dissipates heat generated by the laser, ensuring wavelength stability. (3)Microring resonator: serves as a high-performance optical resonant structure in photonic integrated circuits (Q value can reach above 10⁶). RF filter: utilizes the piezoelectric effect to fabricate high-performance acoustic filters, widely used in 5G communications.
3.High-Power Power Electronics	(1)LED Packaging Substrates: Heat dissipation bases for high-power LED chips, extending device lifespan (2)Power Transformer Insulation: Insulation support components for high-temperature and high-pressure environments (3)New Energy Vehicle Electronic Control Systems: Matching insulation and heat dissipation components for SiC modules
4.Precision Industrial Applications	(1)Corrosion-resistant crucibles: Used in the smelting of metals such as Al, Cu, and Ag, resistant to melt erosion (2)High-temperature heat exchangers: High-efficiency thermal management components in chemical equipment (3)Vacuum chamber assemblies: Vacuum sealing components for equipment such as mass spectrometers and electron microscopes

Product Selection Recommendations

(1)Purity Grade: Choose products made from high-purity powder (>99.5%) to avoid impurities affecting thermal conductivity.

(2)Dimensional Accuracy: Outward tilt angle ≤2‰ is required to ensure assembly accuracy.

(3)Surface Finish: Select "Original Sintered Surface" or "Precision Grinding Surface" depending on the application.

(4)Metallization Treatment: Some applications require surface metallization, electroplating, or brazing. Suppliers with the capability to perform these processes should be selected.

Customized Process

Comprehend application product information from customers ⇒ Engineers create drawings ⇒ Customers confirms drawings ⇒ After customer confirmation, a quotation is prepared ⇒ Confirm quotation and making sample ⇒ Customers confirm sample ⇒ Deposit payment is made ⇒ Mass production begins ⇒ Shipping and receiving tracking ⇒ Order finish

FAQ

Q1: What products does your company offer?

We specialize in high-performance ceramics such as alumina and silicon nitride, providing insulators, structural components, wear-resistant parts, and customized solutions.

Q2: Can you customize non-standard parts?

Yes. We support processing based on provided drawings and collaborative technical development, offering a full-process service from design to mass production.

Q3: What about accuracy and delivery time?

Standard tolerance ±0.05mm, precision grade ±0.01mm; samples 7-15 days, bulk orders 20-30 days.

Q4: Main application areas?

Power, electronics, machinery, chemical, and aerospace industries.

Q5: Quality assurance measures?

Full-process quality inspection, providing material reports and performance test data, supporting third-party certification and testing.

Q6: Do you provide technical support?

We provide professional support such as material selection consultation, design optimization, and failure analysis.

Why choose us?

1.Customized R&D, rather than standard product adaptation

2.Deep control of materials science：Material Selection Based on Needs，Microstructure Optimization，Batch Consistency

3.Precision machining capability：Flatness can reach 0.001mm, parallelism 0.002mm, and roughness Ra 0.1μm.