High Thermal Conductivity Silicon Carbide Ceramic Nozzle for Semiconductor Packaging

High Thermal Conductivity Silicon Carbide SiC Ceramic Nozzle

Product Description

Silicon carbide SiC nozzle is precision adsorption components made primarily of high-performance silicon carbide (SiC) ceramic material, belonging to the category of advanced ceramic nozzles. Compared to traditional metal or ordinary ceramic nozzles, SiC nozzles exhibit irreplaceable advantages in high-end fields such as semiconductor packaging and testing, and precision electronics manufacturing due to their inherent material properties. This product is formed through atmospheric pressure sintering or reaction sintering processes, enabling the fabrication of precision adsorption holes with a minimum diameter of 0.1 mm, meeting the manipulation requirements of micro- and nano-scale components.

Core advantages: 

1. Extended Service Life: In the Flip Chip packaging process, the wear resistance of silicon carbide nozzles extends their service life by 3-5 times compared to alumina ceramics and 5-8 times compared to cemented carbide, significantly reducing equipment downtime for replacements.
2. Uniform Adsorption Performance: The fine and uniformly distributed pore design, combined with the high rigidity of silicon carbide material, enables uniform and stable vacuum adsorption in various tiny local areas of the wafer, avoiding chip damage caused by stress concentration.
3. Improved Process Efficiency: Excellent thermal conductivity reduces wafer heating/cooling time by 30%-50%, significantly improving production cycle time in processes such as wax adhesion and hot pressing.
4. Adaptability to Extreme Environments: Suitable for high-temperature and corrosive process environments such as plasma etching and chemical vapor deposition, with a wide operating temperature range from -50℃ to 1650℃.

Key Manufacturing Processes

1.Powder Preparation: High-purity α-SiC micro powder (purity ≥99.5%, particle size 0.5-5μm) is used.

2.Forming Process: Blanks are obtained through isostatic pressing or injection molding.

3.Precision Machining: Turning, milling, and drilling are performed using diamond tools, with drilling speed controlled at 600-900 r/min.

4.High-Temperature Sintering: Sintering is carried out in an inert atmosphere at 2100-2200℃ for 2-4 hours.

5.Precision Grinding: Multi-pass precision polishing is performed using diamond polishing paste.

6.Quality Inspection: Full-dimensional inspection is performed using a coordinate measuring machine and metallographic microscope.

Typical technical parameters

Customized Process

 

Comprehend application product information from customers ⇒ Engineers create drawings ⇒ Customers confirms drawings ⇒ After customer confirmation, a quotation is prepared ⇒ Confirm quotation and making sample ⇒ Customers confirm sample ⇒ Deposit payment is made ⇒ Mass production begins ⇒ Shipping and receiving tracking ⇒ Order finish

FAQ

Q1: What products does your company offer?

We specialize in high-performance ceramics such as alumina and silicon nitride, providing insulators, structural components, wear-resistant parts, and customized solutions.

Q2: Can you customize non-standard parts?

Yes. We support processing based on provided drawings and collaborative technical development, offering a full-process service from design to mass production.

Q3: What about accuracy and delivery time?

Standard tolerance ±0.05mm, precision grade ±0.01mm; samples 7-15 days, bulk orders 20-30 days.

Q4: Main application areas?

Power, electronics, machinery, chemical, and aerospace industries.

Q5: Quality assurance measures?

Full-process quality inspection, providing material reports and performance test data, supporting third-party certification and testing.

Q6: Do you provide technical support?

We provide professional support such as material selection consultation, design optimization, and failure analysis.

Why choose us?

1.Customized R&D, rather than standard product adaptation

2.Deep control of materials science：Material Selection Based on Needs，Microstructure Optimization，Batch Consistency

3.Precision machining capability：Flatness can reach 0.001mm, parallelism 0.002mm, and roughness Ra 0.1μm.

Our workshop