99% High Efficiency Zirconia Ceramic Knife Cutter Cutlery Plate for Semiconductor
99% Ceramic Cutter is made of high-purity zirconium oxide, this blade boasts high hardness, wear resistance, and corrosion resistance. Its sharp, long-lasting edge, free from metal contamination, it suitable for precision cutting of films, paper, fibers and pharmaceutical materials, producing a clean cut and offering a service life far exceeding that of traditional metal knives.
99% Ceramic Cutlery Cutter for Semiconductor
Product Description
Zirconia ceramic cutters are key consumables in high-end precision manufacturing. They are not "knives" in the ordinary sense, but high-tech industrial tools. Their value lies in their superior physical and chemical properties, which enable them to achieve high yield, high efficiency, and high consistency when cutting high-precision, sharp, and brittle materials. They are indispensable "precision cutting artists" in industries such as semiconductors and optoelectronics.
Advantages
1.Extremely High Hardness and Wear Resistance:** Second only to diamond in hardness, its service life far exceeds that of cemented carbide tools, significantly reducing tool change frequency and downtime. It is particularly suitable for cutting high-hardness materials such as sapphire and silicon wafers.
2.Extremely High Dimensional Accuracy and Stability:** Zirconia ceramic exhibits virtually no deformation after sintering. The cutting edge can be ground to an extremely sharp point with excellent edge retention, ensuring a minimal kerf, minimal material loss, and a straight, smooth cut, thus improving product yield.
3.Excellent Chemical Stability and Corrosion Resistance:** It does not rust and can withstand most chemical solvents, making it suitable for long-term operation in coolant or special chemical environments without contaminating the processed material due to chemical reactions.
4.Low Coefficient of Friction and Self-Lubricating Properties:Low cutting resistance and relatively low heat generation reduce processing stress and minimize defects such as chipping and microcracks.
5.Non-Magnetic and Insulating:Suitable for processing applications sensitive to magnetic fields or requiring an insulating environment.
Applications
| Detailed description | |
| Application industries |
1.1. Semiconductor and Integrated Circuit Manufacturing: Core application area. Used for wafer dicing, chip cutting, and semiconductor substrate splitting. 2. Precision Electronic Component Manufacturing: Cutting brittle electronic materials such as LED sapphire substrates, ceramic capacitors, quartz crystal resonators, and fiberglass circuit boards. 3.3. Optics and Optoelectronics Industry: Cutting optical glass, LCD glass, sapphire cover plates, and various lenses. 4. New Energy Industry: Cutting fuel cell separators, special battery separators, and photovoltaic materials. 5. Biomedical: Used for cutting and processing precision medical devices. |
| Application scenarios |
1. Precision dicing and cutting: Installed on high-precision dicing or cutting machines, it performs straight or curved cuts on high-hardness, high-brittleness, and high-value materials to separate them into micro-units. 2. Cleanroom processing: Used in cleanrooms, its non-magnetic nature and lack of metal shavings prevent contamination of the processed products. 3. Dry or micro-lubricated cutting: Its wear resistance and chemical stability allow it to operate with small amounts of deionized water or special coolants, reducing subsequent cleaning costs. 4. Automated production line integration: As a standard consumable, it is integrated into precision machining equipment with automated loading and unloading for high-volume, high-consistency production. |
FAQ
Q1: What products does your company offer?
We specialize in high-performance ceramics such as alumina and silicon nitride, providing insulators, structural components, wear-resistant parts, and customized solutions.
Q2: Can you customize non-standard parts?
Yes. We support processing based on provided drawings and collaborative technical development, offering a full-process service from design to mass production.
Q3: What about accuracy and delivery time?
Standard tolerance ±0.05mm, precision grade ±0.01mm; samples 7-15 days, bulk orders 20-30 days.
Q4: Main application areas?
Power, electronics, machinery, chemical, and aerospace industries.
Q5: Quality assurance measures?
Full-process quality inspection, providing material reports and performance test data, supporting third-party certification and testing.
Q6: Do you provide technical support?
We provide professional support such as material selection consultation, design optimization, and failure analysis.
Why choose us?
1.Customized R&D, rather than standard product adaptation
2.Deep control of materials science:Material Selection Based on Needs,Microstructure Optimization,Batch Consistency
3.Precision machining capability:Flatness can reach 0.001mm, parallelism 0.002mm, and roughness Ra 0.1μm.
Our workshop
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CNC Workshop |
Testing Room |
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Surface grinding Workshop |
Sintering Workshop |
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Circular Grinding Workshop |
Injection molding Machine Workshop |
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